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CC0805ZRYSV5BB181 Datasheet(PDF) 11 Page - YAGEO Corporation |
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CC0805ZRYSV5BB181 Datasheet(HTML) 11 Page - YAGEO Corporation |
11 / 14 page www.yageo.com Jul 29, 2010 V.5 General Purpose & High Cap. 6.3 V to 50 V Surface-Mount Ceramic Multilayer Capacitors 11 14 Product specification Y5V TEST TEST METHOD PROCEDURE REQUIREMENTS Mounting in accordance with IEC 60384-22 paragraph 4.3 No visible damage Bond strength of plating on end face IEC 60384- 21/22 4.8 Conditions: bending 1 mm at a rate of 1 mm/s, radius jig 340 mm <General purpose series> ∆C/C Class2: Y5V: ±10% <High Capacitance series> ∆C/C Class2: Y5V: ±10% Dissolution of the end face plating shall not exceed 25% of the length of the edge concerned <General purpose series> ∆C/C Class2: Y5V: ±20% <High Capacitance series> ∆C/C Class2: Y5V: ±20% Resistance to soldering heat 4.9 Precondition: 150 +0/–10 °C for 1 hour, then keep for 24 ±1 hours at room temperature Preheating: for size ≤ 1206: 120 °C to 150 °C for 1 minute Preheating: for size >1206: 100 °C to 120 °C for 1 minute and 170 °C to 200 °C for 1 minute Solder bath temperature: 260 ±5 °C Dipping time: 10 ±0.5 seconds Recovery time: 24 ±2 hours D.F. within initial specified value Rins within initial specified value Solderability 4.10 Preheated the temperature of 80 °C to 140 °C and maintained for 30 seconds to 60 seconds. Test conditions for lead containing solder alloy Temperature: 235 ±5 °C Dipping time: 2 ±0.2 seconds Depth of immersion: 10 mm Alloy Composition: 60/40 Sn/Pb Number of immersions: 1 Test conditions for leadfree containing solder alloy Temperature: 245 ±5 °C Dipping time: 3 ±0.3 seconds Depth of immersion: 10 mm Alloy Composition: SAC305 Number of immersions: 1 The solder should cover over 95% of the critical area of each termination |
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