© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 (864) 963-6300 • www.kemet.com

C1020_X7R_KPS_SMD • 5/30/2013

99

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)

KPS Series, X7R Dielectric, 10 – 250 VDC (Commercial Grade)

Table 3 – KPS Land Pattern Design Recommendations (mm)

EIA SIZE

CODE

METRIC

SIZE

CODE

Median (Nominal) Land Protrusion

C

Y

X

V1

V2

1210

3225

1.50

1.14

1.75

5.05

3.40

1812

4532

2.20

1.35

2.87

6.70

4.50

2220

5650

2.69

2.08

4.78

7.70

6.00

Soldering Process

KEMET’s KPS Series devices are compatible with IR reflow

techniques. Preheating of these components is recommended

to avoid extreme thermal stress. KEMET's recommended profile

conditions for IR reflow reflect the profile conditions of the

IPC/J–STD–020D standard for moisture sensitivity testing.

To prevent degradation of temperature cycling capability, care

must be taken to prevent solder from flowing into the inner side

of the lead frames (inner side of "J" lead in contact with the

circuit board).

After soldering, the capacitors should be air cooled to room

temperature before further processing. Forced air cooling is not

recommended.

Hand soldering should be performed with care due to the

difficulty in process control. If performed, care should be taken

to avoid contact of the soldering iron to the capacitor body. The

iron should be used to heat the solder pad, applying solder

between the pad and the lead, until reflow occurs. Once reflow

occurs, the iron should be removed immediately. (Preheating is

required when hand soldering to avoid thermal shock.)

Profile Feature

SnPb Assembly Pb-Free Assembly

Preheat/Soak

Temperature Minimum (T

100°C

150°C

Temperature Maximum (T

150°C

200°C

Time (t

60 – 120 seconds

60 – 120 seconds

Ramp-up Rate (T

3°C/seconds maximum

3°C/seconds maximum

Liquidous Temperature (T

183°C

217°C

Time Above Liquidous (t

60 – 150 seconds

60 – 150 seconds

Peak Temperature (T

235°C

250°C

Time within 5°C of Maximum

Peak Temperature (t

20 seconds maximum

10 seconds maximum

Ramp-down Rate (T

6°C/seconds maximum

6°C/seconds maximum

Time 25°C to Peak Temperature

6 minutes maximum

8 minutes maximum

Note: All temperatures refer to the center of the package, measured on the

package body surface that is facing up during assembly reflow.

Time

25ºC to Peak

25

Maximum Ramp Up Rate = 3ºC/seconds

Maximum Ramp Down Rate = 6ºC/seconds