CAV24C02, CAV24C04, CAV24C08, CAV24C16

http://onsemi.com

2

DEVICE MARKINGS

(SOIC−8)

(TSSOP−8)

CSSS

AYMXXX

24CSSS

AYMXXX

G

G

CSSS

= Specific Device Code, where

SSS = 02H for CAV24C02

SSS = 04K for CAV24C04

SSS = 08K for CAV24C08

SSS = 16K for CAV24C16

A

= Assembly Location

Y

= Production Year (Last Digit)

M

= Production Month (1−9, O, N, D)

XXX

= Last Three Digits of Assembly Lot Number

G

= Pb−Free Package

24CSSS = Specific Device Code, where

SSS = 02H for CAV24C02

SSS = 04K for CAV24C04

SSS = 08K for CAV24C08

SSS = 16K for CAV24C16

A

= Assembly Location

Y

= Production Year (Last Digit)

M

= Production Month (1−9, O, N, D)

XXX

= Last Three Digits of Assembly Lot Number

G

= Pb−Free Package

Table 1. ABSOLUTE MAXIMUM RATINGS

Parameters

Ratings

Units

Storage Temperature

−65 to +150

°C

Voltage on any pin with respect to Ground (Note 1)

−0.5 to +6.5

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Symbol

Parameter

Min

Units

Endurance

1,000,000

Program / Erase Cycles

Data Retention

100

Years

2. These parameters are tested initially and after a design or process change that affects the parameter according to appropriate AEC−Q100

and JEDEC test methods.

Table 3. D.C. OPERATING CHARACTERISTICS

Symbol

Parameter

Test Conditions

Min

Max

Units

Read Current

1

mA

Write Current

2

mA

Standby Current

5

mA

I/O Pin Leakage

2

mA

Input Low Voltage

−0.5

V

Input High Voltage

V

SCL and SDA

5.5

V

Output Low Voltage

0.4

V