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mlcc_prec-P1

mlcc_prec_e-01

＊This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.

For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs.

1. Circuit Design

Precautions

◆Verification of operating environment, electrical rating and performance

1.A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications.

Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general pur-

pose applications.

◆Operating Voltage（Verification of Rated voltage）

1.The operating voltage for capacitors must always be their rated voltage or less.

If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less.

For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less.

2.Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage

having rapid rise time is used in a circuit.

2. PCB Design

Precautions

◆Pattern configurations（Design of Land-patterns）

1. When capacitors are mounted on PCBs, the amount of solder used（size of fillet）can directly affect the capacitor performance. Therefore, the following items must

be carefully considered in the design of land patterns:

（1）Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper

amount of solder.

（2）When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist.

◆Pattern configurations（Capacitor layout on PCBs）

After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processes（PCB cutting, board inspection,

mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc.）.For this reason, land pattern configurations and positions of capacitors

shall be carefully considered to minimize stresses.

Technical

consider-

ations

◆Pattern configurations（Design of Land-patterns）

The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts.

（1）Recommended land dimensions for typical chip capacitors

●Multilayer Ceramic Capacitors : Recommended land dimensions（unit: mm）

　Wave-soldering

Land patterns for PCBs

Type

107

212

316

325

Size

L

1.6

2.0

3.2

3.2

W

0.8

1.6

2.5

A

0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5

B

0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7

C

0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5

Solder-resist

Chip capacitor

L

L

W

B

C

B

A

W

LWDC

Land

Chip capacitor

Reflow-soldering

Type

042

063

105

107

212

316

325

432

Size

L

0.4

0.6

1.0

1.6

2.0

3.2

3.2

4.5

W

0.2

0.3

0.5

0.8

1.6

2.5

3.2

A

0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.8 to 1.2 1.8 to 2.5 1.8 to 2.5 2.5 to 3.5

B

0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.8 to 1.2 1.0 to 1.5 1.0 to 1.5 1.5 to 1.8

C

0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 0.9 to 1.6 1.2 to 2.0 1.8 to 3.2 2.3 to 3.5

●LWDC: Recommended land dimensions for reflow-soldering（unit: mm）

Type

105

107

212

Size

L

0.52

1.25

W

1.0

1.6

2.0

A

0.18 to 0.22

0.25 to 0.3

0.5 to 0.7

B

0.2 to 0.25

0.3 to 0.4

0.4 to 0.5

C

0.9 to 1.1

1.5 to 1.7

1.9 to 2.1

●Array type: Recommended land dimensions for reflow-soldering（unit: mm）

2 circuits

4 circuits

Type

096（2 circuits）110（2 circuits）212（2 circuits） 212（4 circuits）

Size

L

0.9

1.37

2.0

2.0

W

0.6

1.0

1.25

1.25

a

0.25 to 0.35

0.35 to 0.45

0.5 to 0.6

0.5 to 0.6

b

0.15 to 0.25

0.55 to 0.65

0.5 to 0.6

0.5 to 0.6

c

0.15 to 0.25

0.3 to 0.4

0.5 to 0.6

0.2 to 0.3

d

0.45

0.64

1.0

0.5

Chip capacitor

a

a

b

d

c

Land

c

d

a

a

b

（2）Examples of good and bad solder application

Items

Not recommended

Recommended

Mixed mounting of

SMD and leaded

components

Component

placement close to

the chassis

Hand-soldering

of leaded

components

near mounted

components

Horizontal

component

placement

Precautions on the use of Multilayer Ceramic Capacitors

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