NCP1835B

http://onsemi.com

3

Figure 2. Detailed Block Diagram

Startup,

Control

& Clamp

TIMER

VREF

VCC

Resistor

Dividers

Bias Circuits

Recharge

Comp

V2P8

Precharge

Comp

Timer

Comp

CC

CV

Control

Temp

Vbat

Resistor

Dividers

VREF

VREF

VREF

VREF

IREF

LOGIC

Chip

Enable

V2P8

VSNS

BAT

ISEL

EN

GND

TIMER

FAULT

CFLG

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Supply Voltage

7.0

V

Status Flag Output Pins

7.0

V

Voltage Range for Other Pins

5.5

V

Current Out from BAT Pin

1.2

A

Thermal Characteristics

Thermal Resistance, Junction−to−Air (Note 3)

68.5

1.09

°C/W

W

Moisture Sensitivity (Note 4)

MSL

Level 1

Operating Ambient Temperature

−20 to 70

°C

Storage Temperature

−55 to 125

°C

ESD

Human Body Model

Machine Model

HBM

MM

2000

200

V

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and is tested per the following standards:

Human Body Model (HBM) per JEDEC standard: JESD22−A114.

Machine Model (MM) per JEDEC standard: JESD22−A115.

2. Latchup Current Maximum Rating: 150 mA per JEDEC standard: JESD78.

sq. of 1 oz. copper area on 4 layer PCB that has 1 single signal layer with the additional 3 solid ground or power planes. The maximum package

power dissipation limit must not be exceeded:

PD +

TJ(max) * TA

R

qJA

4. Moisture Sensitivity Level per IPC/JEDEC standard: J−STD−020A.