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NCP1835BMNR2 Datasheet(PDF) 3 Page - ON Semiconductor |
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NCP1835BMNR2 Datasheet(HTML) 3 Page - ON Semiconductor |
3 / 14 page NCP1835B http://onsemi.com 3 Figure 2. Detailed Block Diagram Startup, Control & Clamp TIMER VREF VCC Resistor Dividers Bias Circuits Recharge Comp V2P8 Precharge Comp Timer Comp CC CV Control Temp Vbat Resistor Dividers VREF VREF VREF VREF IREF LOGIC Chip Enable V2P8 VSNS BAT ISEL EN GND TIMER FAULT CFLG VCC MAXIMUM RATINGS Rating Symbol Value Unit Supply Voltage VCC 7.0 V Status Flag Output Pins VFAULT, VCFLG 7.0 V Voltage Range for Other Pins Vio 5.5 V Current Out from BAT Pin IO 1.2 A Thermal Characteristics Thermal Resistance, Junction−to−Air (Note 3) Power Dissipation, TA = 25°C (Note 3) RqJA PD 68.5 1.09 °C/W W Moisture Sensitivity (Note 4) MSL Level 1 Operating Ambient Temperature TA −20 to 70 °C Storage Temperature Tstg −55 to 125 °C ESD Human Body Model Machine Model HBM MM 2000 200 V V Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. This device series contains ESD protection and is tested per the following standards: Human Body Model (HBM) per JEDEC standard: JESD22−A114. Machine Model (MM) per JEDEC standard: JESD22−A115. 2. Latchup Current Maximum Rating: 150 mA per JEDEC standard: JESD78. 3. Measure on 1 inch sq. of 1 oz. copper area. RqJA is highly dependent on the PCB heatsink area. For example, RqJA can be 38°C/W on 1 inch sq. of 1 oz. copper area on 4 layer PCB that has 1 single signal layer with the additional 3 solid ground or power planes. The maximum package power dissipation limit must not be exceeded: PD + TJ(max) * TA R qJA with RqJA = 68.5°C/W, TJ(max) = 100°C, PD = 1.09 W. 4. Moisture Sensitivity Level per IPC/JEDEC standard: J−STD−020A. |
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