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DRV8816PWP Datasheet(PDF) 10 Page - Texas Instruments |
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DRV8816PWP Datasheet(HTML) 10 Page - Texas Instruments |
10 / 17 page ( ) ( ) 2 TOT D SON OUT RMS P I ( R ) = ´ DRV8816 SLRS063 – SEPTEMBER 2013 www.ti.com OVERCURRENT PROTECTION (OCP) The current flowing through the high-side and low-side drivers is monitored to ensure that the motor lead is not shorted to supply or ground. If a short is detected, all FETs in the H-bridge will be disabled, nFAULT is driven low, and a tOCP fault timer is started. After this period, tOCP, the device is then allowed to follow the input commands and another turn-on is attempted (nFAULT becomes high again during this attempt). If there is still a fault condition, the cycle repeats. If after tOCP expires it is determined the short condition is not present, normal operation resumes and nFAULT is released. OVERTEMPERATURE WARNING (OTW) If the die temperature increases past the thermal warning threshold the nFAULT pin will be driven low. Once the die temperature has fallen below the hysteresis level, the nFAULT pin will be released. If the die temperature continues to increase, the device will enter over temperature shutdown as described below. OVERTEMPERATURE SHUTDOWN (OTS) If the die temperature exceeds safe limits, all FETs in the H-bridge will be disabled and the charge pump will be shut down. Once the die temperature has fallen to a safe level operation will automatically resume. THERMAL INFORMATION Thermal Protection If the die temperature exceeds approximately 150°C, the device will be disabled until the temperature drops to a safe level. Any tendency of the device to enter thermal shutdown is an indication of either excessive power dissipation, insufficient heatsinking, or too high an ambient temperature. Power Dissipation Power dissipation in the DRV8816 is dominated by the power dissipated in the output FET resistance, or RDS(ON). Average power dissipation can be roughly estimated by: (1) where PTOT is the total power dissipation, RD(SON) is the resistance of the HS plus LS FETS, and IOUT(RMS) is the RMS output current being applied to each winding. IOUT(RMS) is equal to approximately 0.7× the full-scale output current setting. The maximum amount of power that can be dissipated in the device is dependent on ambient temperature and heatsinking. Note that RDS(ON) increases with temperature, so as the device heats, the power dissipation increases. PCB LAYOUT Ground A ground power plane should be located as close to DRV8816 as possible. The copper ground plane directly under the PowerPAD package makes a good location. This pad can then be connected to ground for this purpose. Layout Considerations The printed circuit board (PCB) should use a heavy ground plane. For optimum electrical and thermal performance, the DRV8816 must be soldered directly onto the board. On the underside of the DRV8816 is a PowerPAD package, which provides a path for enhanced thermal dissipation. The thermal pad should be soldered directly to an exposed surface on the PCB. Thermal vias are used to transfer heat to other layers of the PCB. The load supply pin, VBB, should be decoupled with an electrolytic capacitor (typically 100 μF) in parallel with a ceramic capacitor placed as close as possible to the device. The ceramic capacitors between VCP and VBB, connected to VREG, and between CP1 and CP2 should be as close to the pins of the device as possible, in order to minimize lead inductance. 10 Submit Documentation Feedback Copyright © 2013, Texas Instruments Incorporated Product Folder Links: DRV8816 |
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