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LP3982ILDX-1.8 Datasheet(PDF) 2 Page - Texas Instruments |
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LP3982ILDX-1.8 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 23 page PD = TJ(MAX) - TA 6JA (4) Maximum Power dissipation for the device is calculated using the following equations: where TJ(MAX) is the maximum LP3982 SNVS185D – FEBRUARY 2002 – REVISED APRIL 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ABSOLUTE MAXIMUM RATINGS (1) (2) (3) VIN, VOUT, VSHDN, VSET, VCC, VFAULT −0.3V to 6.5V Fault Sink Current 20mA Power Dissipation See(4) Storage Temperature Range −65°C to 160°C Junction Temperature (TJ) 150°C Lead Temperature (10 sec.) 260°C Human Body Model(5) 2kV ESD Rating Machine Model 200V 8-Pin VSSOP 223°C/W Thermal Resistance ( θJA) 8-Pin WSON See(4) (1) Absolute Maximum ratings indicate limits beyond which damage may occur. Electrical specifications do not apply when operating the device outside of its rated operating conditions. (2) All voltages are with respect to the potential at the ground pin. (3) If Military/Aerospace specified devices are required, please contact Texas Instruments Sales Office/Distributors for availability and specifications. junction temperature, TA is the ambient temperature, and θJA is the junction-to-ambient thermal resistance. For example, for the VSSOP- 8 package θJA = 223°C/W, TJ(MAX) = 150°C and using TA = 25°C; the maximum power dissipation is found to be 561 mW. The derating factor ( −1/θJA) = −4.5 mW/°C, thus below 25°C the power dissipation figure can be increased by 4.5 mW per degree, and similarity decreased by this factor for temperatures above 25°C. The value of the θJA for the WSON package is specifically dependent on the PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, refer to Application Note AN-1187 SNOA401. (5) Human body model: 1.5 k Ω in series with 100 pF. RECOMMENDED OPERATING CONDITIONS (1) (2) Temperature Range −40°C to 85°C Supply Voltage 2.5V to 6.0V (1) Absolute Maximum ratings indicate limits beyond which damage may occur. Electrical specifications do not apply when operating the device outside of its rated operating conditions. (2) All voltages are with respect to the potential at the ground pin. ELECTRICAL CHARACTERISTICS Unless otherwise specified, all limits specified for VIN = VO +0.5V (1), V SHDN = VIN, CIN = COUT = 2.2μF, CCC = 33nF, TJ = 25°C. Boldface limits apply for the operating temperature extremes: −40°C and 85°C. Symbol Parameter Conditions Min(2) Typ(3) Max(2) Units VIN Input Voltage 2.5 6.0 V ΔVO Output Voltage Tolerance 100 μA ≤ IOUT ≤ 300 mA −2 +2 % of VOUT VIN = VO +0.5V (1) −3 +3 (NOM) SET = OUT for the Adjust Versions VO Output Adjust Range Adjust Version Only 1.25 6 V IO Maximum Output Current Average DC Current Rating 300 mA ILIMIT Output Current Limit 330 770 mA IQ Supply Current IOUT = 0mA 90 270 μA IOUT = 300 mA 225 Shutdown Supply Current VO = 0V, SHDN = GND 0.001 1 μA (1) Condition does not apply to input voltages below 2.5V since this is the minimum input operating voltage. (2) All limits are verified by testing or statistical analysis. (3) Typical Values represent the most likely parametric norm. 2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: LP3982 |
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