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CM50MXA-24S Datasheet(PDF) 6 Page - Powerex Power Semiconductors |
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CM50MXA-24S Datasheet(HTML) 6 Page - Powerex Power Semiconductors |
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6 / 15 page  CM50MXA-24S NX-Series CIB Module (3Ø Converter + 3Ø Inverter + Brake) 50 Amperes/1200 Volts 6 03/13 Rev. 3 Powerex, Inc., 173 Pavilion Lane,Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com Electrical Characteristics, Tj = 25°C unless otherwise specified (continued) Converter Part ConvDi Characteristics Symbol Test Conditions Min. Typ. Max. Units Repetitive Peak Reverse Current IRRM VR = VRRM, Tj = 150°C — — 6.0 mA Forward Voltage VF IF = 50A*6 — 1.2 1.6 Volts (Terminal) NTC Thermistor Part Characteristics Symbol Test Conditions Min. Typ. Max. Units Zero Power Resistance R25 TC = 25°C*4 4.85 5.00 5.15 kΩ Deviation of Resistance ∆R/R TC = 100°C*4, R100 = 493Ω -7.3 — +7.8 % B Constant B(25/50) Approximate by Equation*7 — 3375 — K Power Dissipation P25 TC = 25°C*4 — — 10 mW Thermal Resistance Characteristics Thermal Resistance, Junction to Case*4 Rth(j-c)Q Per Inverter IGBT — — 0.35 K/W Thermal Resistance, Junction to Case*4 Rth(j-c)D Per Inverter FWDi — — 0.63 K/W Thermal Resistance, Junction to Case*4 Rth(j-c)Q Per Brake IGBT — — 0.42 K/W Thermal Resistance, Junction to Case*4 Rth(j-c)D Per Brake ClampDi — — 0.69 K/W Thermal Resistance, Junction to Case*4 Rth(j-c)D Per Converter ConvDi — — 0.33 K/W Contact Thermal Resistance, Rth(c-f) Thermal Grease Applied, — 15 — K/kW Case to Heatsink*4 Per 1 Module*8 *4 Case temperature (TC) and heatsink temperature (Ts) is measured on the surface (mounting side) of the baseplate and the heatsink side just under the chips. Refer to the figure to the right for chip location. The heatsink thermal resistance should be measured just under the chips. *6 Pulse width and repetition rate should be such as to cause negligible temperature rise. *7 B(25/50) = In( R25 )/( 1 – 1 ) R50 T25 T50 R25; Resistance at Absolute Temperature T25 [K]; T25 = 25 [°C] + 273.15 = 298.15 [K] R50; Resistance at Absolute Temperature T50 [K]; T50 = 50 [°C] + 273.15 = 323.15 [K] *8 Typical value is measured by using thermally conductive grease of λ = 0.9 [W/(m • K)]. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 53 54 55 56 57 58 59 60 61 30 29 28 27 26 25 24 23 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 0 0 19.6 22.0 20.4 30.3 31.3 43.9 44.9 18.4 LABEL SIDE Each mark points to the center position of each chip. Tr*P / Tr*N / TrBr (* = U/V/W): IGBT Di*P / Di*N (* = U/V/W): FWDi DiBr: Clamp Di CR*P / CR*N (* = R/S/T): Conv Di Th: NTC Thermistor 24.9 26.2 25.8 34.2 40.8 43.8 Tr Br Di Br Di UN Di VN Di VP Tr VP Di UP Tr UP Di WN Tr UN Tr VN Tr WN Tr WP Th CR RN CR SN CR TN CR RP CR SP CR TP Di WP |
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