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NCP374MU075TXG Datasheet(PDF) 10 Page - ON Semiconductor |
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NCP374MU075TXG Datasheet(HTML) 10 Page - ON Semiconductor |
10 / 11 page NCP374 http://onsemi.com 10 PCB Recommendations The under PAD1 of the NCP374 package shall be connected to an isolated PCB area to increase the heat transfer if necessary for an application standpoint. In any case, the PAD1 shall be not connected to any other potential or GND than the isolated extra copper surface. ORDERING INFORMATION Device Marking Order Current Limit Package Shipping† NCP374MU075TXG NCP 374 750 mA LLGA12 4x4 mm (Pb−Free) 3000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. |
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