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OPA27GUG4 Datasheet(PDF) 2 Page - Texas Instruments |
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OPA27GUG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 22 page OPA27, OPA37 2 SBOS135C www.ti.com Top View PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS(1) Supply Voltage ................................................................................... ±22V Internal Power Dissipation (2) ....................................................... 500mW Input Voltage ..................................................................................... ±V CC Output Short-Circuit Duration (3) ................................................. Indefinite Differential Input Voltage (4) ............................................................. ±0.7V Differential Input Current (4) ........................................................... ±25mA Storage Temperature Range .......................................... –55 °C to +125°C Operating Temperature Range ......................................... –40 °C to +85°C Lead Temperature: P (soldering, 10s) ....................................................................... +300 °C U (soldering, 3s) ......................................................................... +260 °C NOTES: (1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may degrade device reliability. (2) Maximum package power dissipation versus ambient temperature. (2) To common with ±V CC = 15V. (4) The inputs are protected by back-to-back diodes. Current limiting resistors are not used in order to achieve low noise. If differential input voltage exceeds ±0.7V, the input current should be limited to 25mA. PACKAGE PACKAGE PRODUCT PACKAGE-LEAD θ JA DRAWING MARKING OPA27 DIP-8 100 °C/W P OPA27GP OPA27 SO-8 160 °C/W D OPA27U OPA37 DIP-8 100 °C/W P OPA37GP OPA37 SO-8 160 °C/W D OPA37U NOTE: (1) For the most current package and ordering information, see the Package Option Addendum located at the end of this document, or see the TI website at www.ti.com. PACKAGE/ORDERING INFORMATION(1) ELECTROSTATIC DISCHARGE SENSITIVITY This integrated circuit can be damaged by ESD. Texas Instru- ments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 1 2 3 4 5 6 7 8 Offset Trim +V CC –In +In –V CC Output NC NC = No Connection Offset Trim |
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Similar Description - OPA27GUG4 |
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