PAD

PAD

PAD

0

200

400

600

800

1000

0

10

20

30

40

50

60

70

80

FREQUENCY (MHz)

Emissions (Evaluation Board)

EN 55022 Class B Limit

EN 55022 Class A Limit

LMZ10501

SNVS677D – MAY 2011 – REVISED MARCH 2013

www.ti.com

Radiated EMI (CISPR22)

Connection Diagram

Figure 1. Package Number NQB0008A

PIN DESCRIPTIONS

Pin #

Name

Description

1

EN

Enable Input. Set this digital input higher than 1.2V for normal operation. For shutdown, set low. Pin is

internally pulled up to VIN and can be left floating for always-on operation.

2

VCON

Output voltage control pin. Connect to analog voltage from resisitve divider or DAC/controller to set the VOUT

filtering.

3

FB

4

SGND

Ground for analog and control circuitry. Connect to PGND at a single point.

5

VOUT

Output Voltage. Connected to one terminal of the integrated inductor. Connect output filter capacitor between

VOUT and PGND.

6

PGND

Power ground for the power MOSFETs and gate-drive circuitry.

7

VIN

Voltage supply input. Connect ceramic capacitor between VIN and PGND as close as possible to these two

pins. Typical capacitor values are between 4.7µF and 22µF.

8

VREF

2.35V voltage reference output. Typically connected to VCON pin through a resistive divider to set the output

voltage.

PAD

The 3 pads underneath the module are not internally connected to any node. These pads should be

connected to the ground plane for improved thermal performance.

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

2

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