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AD5300BRMZ-REEL7 Datasheet(PDF) 3 Page - Analog Devices

Part No. AD5300BRMZ-REEL7
Description  2.7 V to 5.5 V, 140 muA, Rail-to-Rail Output 8-Bit DAC in a SOT-23
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

AD5300BRMZ-REEL7 Datasheet(HTML) 3 Page - Analog Devices

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AD5300
–3–
REV.
TIMING CHARACTERISTICS1, 2
Limit at TMIN, TMAX
Parameter
VDD = 2.7 V to 3.6 V
VDD = 3.6 V to 5.5 V
Unit
Conditions/Comments
t1
3
50
33
ns min
SCLK Cycle Time
t2
13
13
ns min
SCLK High Time
t3
22.5
13
ns min
SCLK Low Time
t4
13
13
ns min
SYNC to SCLK Falling Edge Setup Time
t5
55
ns min
Data Setup Time
t6
4.5
4.5
ns min
Data Hold Time
t7
00
ns min
SCLK Falling Edge to
SYNC Rising Edge
t8
50
33
ns min
Minimum
SYNC High Time
NOTES
1All input signals are specified with tr = tf = 5 ns (10% to 90% of V
DD) and timed from a voltage level of (VIL + VIH)/2.
2See Figure 1.
3Maximum SCLK frequency is 30 MHz at V
DD = 3.6 V to 5.5 V and 20 MHz at VDD = 2.7 V to 3.6 V.
Specifications subject to change without notice.
SCLK
SYNC
DIN
t8
DB15
DB0
t4
t3
t2
t7
t5
t6
t1
Figure 1. Serial Write Operation
(VDD = 2.7 V to 5.5 V; all specifications TMIN to TMAX, unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS
*
(TA = 25
°C, unless otherwise noted.)
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Digital Input Voltage to GND . . . . . . . –0.3 V to VDD + 0.3 V
VOUT to GND . . . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°C to +105°C
Storage Temperature Range . . . . . . . . . . . . –65
°C to +150°C
Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . 150
°C
SOT-23 Package
Power Dissipation . . . . . . . . . . . . . . . . . . . (TJ max–TA)/
θ
JA
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 240
°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
MSOP Package
Power Dissipation . . . . . . . . . . . . . . . . . . . (TJ max–TA)/
θ
JA
θ
JA Thermal Impedance
. . . . . . . . . . . . . . . . . . . . 206
°C/W
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 44°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215
°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational sections
of this specification is not implied. Exposure to absolute maximum rating condi-
tions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD5300 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
D


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