NCV7240

http://onsemi.com

5

MAXIMUM RATINGS

Parameter

Min

Max

Unit

Supply Input Voltage (VDDA, VDD)

DC

−0.3

5.5

V

Digital I/O pin voltage

(EN, LHI, Inx, CSB, SCLK, SI)

(SO)

−0.3

−0.3

5.5

V

High Voltage Pins (OUTx)

DC

Peak Transient

−0.3

36

44 (Note 1)

V

Output Current (OUTx)

−1

1.3

A

Clamping Energy

Maximum (single pulse)

Repetitive (multiple pulse) (Note 2)

−

−

75

−

Operating Junction Temperature Range

−40

150

°C

Storage Temperature Range

−55

150

°C

ESD Capability,

Human body model (100 pF, 1.5 kW) (OUTx pins)

Human body model (100 pF, 1.5 kW) (all other pins)

−4000

−2000

4000

2000

V

ESD Capability

Machine Model (200 pF)

−200

200

V

AECQ10x−12−RevA

Short Circuit Reliability Characterization

Grade A

−

PACKAGE

Moisture Sensitivity Level

MSL2

−

Lead Temperature Soldering: SMD style only, Reflow (Note 3)

Pb−Free Part 60 − 150 sec above 217°C, 40 sec max at peak

265 peak

°C

Package Thermal Resistance (per JESD51)

SSOP−24

Junction−to−Ambient (2s2p) (Notes 4 and 5)

Junction−to−Pin (pins 1, 2, 11, 12) (Note 6)

68

62

30

°C/W

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Internally limited. Specification applies to unpowered and powered modes. (0 V to VDDA, 0 V to VDD)

3. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D

and Application Note AND8083/D.

vias.

5. Include 2 inner 1 oz copper layers. No vias.

6. One output dissipating 100 mW.

Figure 4. Repetitive Clamping Energy Test