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IRFB16N50K Datasheet(PDF) 5 Page - Kersemi Electronic Co., Ltd. |
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IRFB16N50K Datasheet(HTML) 5 Page - Kersemi Electronic Co., Ltd. |
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5 / 7 page 
5 IRFB16N50K, SiHFB16N50K Fig. 9 - Maximum Drain Current vs. Case Temperature Fig. 10a - Switching Time Test Circuit Fig. 10b - Switching Time Waveforms Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case Fig. 12a - Unclamped Inductive Test Circuit Fig. 12b - Unclamped Inductive Waveforms 25 50 75 100 125 150 TC , Case Temperature (°C) 0 5 10 15 20 Pulse width ≤ 1 µs Duty factor ≤ 0.1 % R D V GS R G D.U.T. 10 V + - V DS V DD V DS 90 % 10 % V GS t d(on) t r t d(off) t f 1E-006 1E-005 0.0001 0.001 0.01 0.1 1 t1 , Rectangular Pulse Duration (sec) 0.001 0.01 0.1 1 0.20 0.10 D = 0.50 0.02 0.01 0.05 SINGLE PULSE ( THERMAL RESPONSE ) Notes: 1. Duty Factor D = t1/t2 2. Peak Tj = P dm x Zthjc + Tc RG IAS 0.01 Ω tp D.U.T. L VDS + - VDD Driver A 15 V 20 V IAS VDS tp www.kersemi.com |
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