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OPA211AIDRGR Datasheet(PDF) 3 Page - Texas Instruments |
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OPA211AIDRGR Datasheet(HTML) 3 Page - Texas Instruments |
3 / 37 page PIN CONFIGURATIONS 1 2 3 4 8 7 6 5 NC (1) V+ OUT NC (1) NC (1) -IN +IN V- 1 2 3 4 8 7 6 5 Shutdown (3) V+ OUT NC (1) NC (1) -IN +IN V- 1 2 3 4 8 7 6 5 Shutdown (3) V+ OUT NC (1) NC (1) -IN +IN V- Pad (2) 1 2 3 4 8 7 6 5 V+ OUTB -INB +INB OUTA -INA +INA V- Pad (2) A B 1 2 3 4 8 7 6 5 V+ OUTB -INB +INB OUTA -INA +INA V- A B Pad (2) OPA211 OPA2211 www.ti.com...................................................................................................................................................... SBOS377G – OCTOBER 2006 – REVISED MAY 2009 OPA211 OPA211 SO-8 MSOP-8 OPA211 OPA2211 DFN-8 (3mm × 3mm) DFN-8 (3mm × 3mm) OPA2211 SO-8 PowerPAD (1) NC denotes no internal connection. (2) Exposed thermal die pad on underside; connect thermal die pad to V–. Soldering the thermal pad improves heat dissipation and provides specified performance. (3) Shutdown function: • Device enabled: (V–) ≤ VSHUTDOWN ≤ (V+) – 3V • Device disabled: VSHUTDOWN ≥ (V+) – 0.35V Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 3 Product Folder Link(s): OPA211 OPA2211 |
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