SN74AUP3G14

SCES764D – SEPTEMBER 2009 – REVISED AUGUST 2012

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The SN74AUP3G14 contains three inverters and performs the Boolean function Y = A. The device functions as

three independent inverters but, because of Schmitt action, it may have different input threshold levels for

NanoStar™ package technology is a major breakthrough in IC packaging concepts, using the die as the

package.

preventing damaging current backflow through the device when it is powered down.

ORDERABLE

TOP-SIDE

PART NUMBER

NanoStar™ – WCSP (DSBGA)

Reel of 3000

SN74AUP3G14YFPR

_ _ _ H F _

0.23-mm Large Bump – YFP (Pb-free)

uQFN – DQE

Reel of 5000

SN74AUP3G14DQER

TX

–40°C to 85°C

QFN – RSE

Reel of 5000

SN74AUP3G14RSER

TX

SSOP – DCU

Reel of 3000

SN74AUP3G14DCUR

H14_

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

web site at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.

(3)

DCU: The actual top-side marking has one additional character that designates the wafer fab/assembly site.

YFP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following

character to designate the wafer fab/assembly site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

2

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