SN65HVD233-HT

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SLLS933F – NOVEMBER 2008 – REVISED AUGUST 2012

THERMAL CHARACTERISTICS FOR D PACKAGE

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

TYP

MAX

UNIT

Junction-to-case thermal resistance (to bottom of case)

49

°C/W

THERMAL CHARACTERISTICS FOR JD PACKAGE

over operating free-air temperature range unless otherwise noted

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

83.4

Junction-to-ambient thermal

°C/W

64.9

Junction-to-board thermal resistance

27.9

°C/W

Junction-to-case thermal resistance

6.49

°C/W

duty

114

mW

(1)

See TI literature number SZZA003 for an explanation of this parameter.

(2)

JESD51-3 low effective thermal conductivity test board for leaded surface-mount packages.

(3)

JESD51-7 high effective thermal conductivity test board for leaded surface-mount packages.

THERMAL CHARACTERISTICS FOR HKJ OR HKQ PACKAGE

over operating free-air temperature range (unless otherwise noted)

PARAMETER

MIN

TYP

MAX

UNIT

to ceramic side of case

5.7

Junction-to-case thermal resistance

°C/W

to top of case lid (metal side of case)

13.7

RECOMMENDED OPERATING CONDITIONS

UNIT

MIN

MAX

Supply voltage

3

3.6

V

Voltage at any bus terminal (separately or common mode)

–7

12

V

High-level input voltage

D, LBK

2

5.5

V

Low-level input voltage

D, LBK

0

0.8

V

Differential input voltage

–6

6

V

0

100

k

Ω

5.5

V

Driver

–50

High-level output current

mA

Receiver

–10

Driver

50

Low-level output current

mA

Receiver

10

Operating junction temperature

212

°C

-55

210

°C

(1)

Maximum free-air temperature operation is allowed as long as the device maximum junction temperature is not exceeded.

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