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SN65HVD233HD Datasheet(PDF) 7 Page - Texas Instruments |
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SN65HVD233HD Datasheet(HTML) 7 Page - Texas Instruments |
7 / 32 page SN65HVD233-HT www.ti.com SLLS933F – NOVEMBER 2008 – REVISED AUGUST 2012 THERMAL CHARACTERISTICS FOR D PACKAGE over operating free-air temperature range (unless otherwise noted) PARAMETER MIN TYP MAX UNIT θJC Junction-to-case thermal resistance (to bottom of case) 49 °C/W THERMAL CHARACTERISTICS FOR JD PACKAGE over operating free-air temperature range unless otherwise noted PARAMETER TEST CONDITIONS MIN TYP MAX UNIT Low-K(2) board, no air flow 83.4 Junction-to-ambient thermal θJA °C/W resistance(1) High-K(3) board, no air flow 64.9 θJB Junction-to-board thermal resistance High-K(3) board, no air flow 27.9 °C/W θJC Junction-to-case thermal resistance 6.49 °C/W RL = 60 Ω, RS = 0 V, input to D a 1-MHz 50% P(AVG) Average power dissipation duty 114 mW cycle square wave, VCC = 3.3 V, TA = 25°C (1) See TI literature number SZZA003 for an explanation of this parameter. (2) JESD51-3 low effective thermal conductivity test board for leaded surface-mount packages. (3) JESD51-7 high effective thermal conductivity test board for leaded surface-mount packages. THERMAL CHARACTERISTICS FOR HKJ OR HKQ PACKAGE over operating free-air temperature range (unless otherwise noted) PARAMETER MIN TYP MAX UNIT to ceramic side of case 5.7 θJC Junction-to-case thermal resistance °C/W to top of case lid (metal side of case) 13.7 RECOMMENDED OPERATING CONDITIONS TA = –55°C to 210°C UNIT MIN MAX VCC Supply voltage 3 3.6 V Voltage at any bus terminal (separately or common mode) –7 12 V VIH High-level input voltage D, LBK 2 5.5 V VIL Low-level input voltage D, LBK 0 0.8 V VID Differential input voltage –6 6 V Resistance from RS to ground 0 100 k Ω VI(Rs) Input voltage at RS for standby 0.75 VCC 5.5 V Driver –50 IOH High-level output current mA Receiver –10 Driver 50 IOL Low-level output current mA Receiver 10 TJ Operating junction temperature 212 °C TA Operating free-air temperature(1) -55 210 °C (1) Maximum free-air temperature operation is allowed as long as the device maximum junction temperature is not exceeded. Copyright © 2008–2012, Texas Instruments Incorporated Submit Documentation Feedback 7 Product Folder Links: SN65HVD233-HT |
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