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ADP5589CP-EVALZ Datasheet(PDF) 5 Page - Analog Devices

Part No. ADP5589CP-EVALZ
Description  Keypad Decoder and I/O Expansion
Download  52 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADP5589CP-EVALZ Datasheet(HTML) 5 Page - Analog Devices

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Data Sheet
ADP5589
Rev. B | Page 5 of 52
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
VDD to Ground
–0.3 V to 4 V
SCL, SDA, RST, INT, R0, R1, R2,
R3, R4, R5, R6, R7, C0, C1, C2,
C3, C4, C5, C6, C7, C8, C9, C10
to Ground
–0.3 V to (VDD + 0.3 V)
Operating Ambient
Temperature Range
−40°C to +85°C1
Operating Junction
Temperature Range
−40°C to +125°C
Storage Temperature Range
−65°C to +150°C
Soldering Conditions
JEDEC J-STD-020
1
In applications where high power dissipation and poor thermal resistance
are present, the maximum ambient temperature may have to be derated.
Maximum ambient temperature (TA(MAX)) is dependent on the maximum
operating junction temperature (TJ(MAXOP) = 125°C), the maximum power
dissipation of the device (PD(MAX)), and the junction-to-ambient thermal
resistance of the part/package in the application (θJA), using the following
equation: TA(MAX) = TJ(MAXOP) − (θJA × PD(MAX)).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to ground.
THERMAL RESISTANCE
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3.
Thermal Resistance
θJA
Unit
24-Lead LFCSP
43.83
C/W
Maximum Power Dissipation
120
mW
25-Ball WLCSP
43
C/W
Maximum Power Dissipation
120
mW
ESD CAUTION


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