ADR225

Data Sheet

Rev. A | Page 4 of 12

ABSOLUTE MAXIMUM RATINGS

Table 2.

Parameter

Rating

Supply Voltage

−0.3 V to +18 V

OUTPUT to GND

Storage Temperature Range

−65°C to +150°C

Operating Temperature Range

8-Lead SOIC

−40°C to +175°C

8-Lead FLATPACK

−40°C to +210°C

Junction Temperature Range

8-Lead SOIC

−40°C to +200°C

8-Lead FLATPACK

−40°C to +245°C

Lead Temperature (Soldering 60 sec)

300°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

PREDICTED LIFETIME vs. OPERATING

TEMPERATURE

Comprehensive reliability testing is performed on the ADR225.

Product lifetimes at extended operating temperature are obtained

using high temperature operating life (HTOL). Lifetimes are

predicted from the Arrhenius equation, taking into account

potential design and manufacturing failure mechanism

assumptions. HTOL is performed to JEDEC JESD22-A108. A

minimum of three wafer fab and assembly lots are processed

through HTOL at the maximum operating temperature.

Comprehensive reliability testing is performed on all Analog

Devices, Inc., high temperature (HT) products.

1

100k

10k

1k

100

10

120

210

200

190

180

170

160

150

140

130

OPERATING TEMPERATURE (°C)

Figure 2. Predicted Lifetime vs. Operating Temperature

THERMAL RESISTANCE

for the device soldered in the circuit board.

Table 3.

Package Type

Unit

8-Lead SOIC

121

43

°C/W

8-Lead FLATPACK

100

15

°C/W

ESD CAUTION