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ADP1754ACPZ-1.1-R7 Datasheet(PDF) 18 Page - Analog Devices |
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ADP1754ACPZ-1.1-R7 Datasheet(HTML) 18 Page - Analog Devices |
18 / 20 page ADP1754/ADP1755 Data Sheet Rev. F | Page 18 of 20 PCB LAYOUT CONSIDERATIONS Heat dissipation from the package can be improved by increas- ing the amount of copper attached to the pins of the ADP1754/ ADP1755. However, as shown in Table 6, a point of diminishing returns is eventually reached, beyond which an increase in the copper size does not yield significant heat dissipation benefits. Here are a few general tips when designing PCBs: • Place the input capacitor as close as possible to the VIN and GND pins. • Place the output capacitor as close as possible to the VOUT and GND pins. • Place the soft start capacitor as close as possible to the SS pin. • Connect the load as close as possible to the VOUT and SENSE pins (ADP1754) or to the VOUT and ADJ pins (ADP1755). Use of 0603 or 0805 size capacitors and resistors achieves the smallest possible footprint solution on boards where area is limited. Figure 46. Evaluation Board Figure 47. Typical Board Layout—Top Side Figure 48. Typical Board Layout—Bottom Side |
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