ADN2830

–10–

REV. B

OUTLINE DIMENSIONS

Figure 7. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-7)

Dimensions shown in millimeters

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADN2830ACPZ32

−40°C to +85°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-7

ADN2830-EVALZ

Evaluation Board

REVISION HISTORY

3/12—Rev. A to Rev. B

Added EPAD Notation .....................................................................4

Updated Outline Dimensions........................................................10

Changes to Ordering Guide...........................................................10

6/03—Rev. 0 to Rev. A

Changes to Absolute Maximum Ratings........................................3

Updated Outline Dimensions........................................................10

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

PIN 1

INDICATOR

3.25

3.10 SQ

2.95

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.50

0.40

0.30

0.25 MIN

©2012 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D03020-0-3/12(B)