TLP118

2010-03-02

8

PRECAUTIONS OF SURFACE MOUNTING TYPE PHOTOCOUPLER SOLDERING &

GENERAL STORAGE

(1) Precautions for Soldering

1) When Using Soldering Reflow

An example of a temperature profile when Sn-Pb eutectic solder is used:

An example of a temperature profile when lead(Pb)-free solder is used:

Reflow soldering must be performed once or twice.

The mounting should be completed with the interval from the first to the last mountings being 2 weeks.

2) When using soldering Flow (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Apply preheating of 150 deg.C for 60 to 120 seconds.

Mounting condition of 260 deg.C or less within 10 seconds is recommended.

Flow soldering must be performed once

3) When using soldering Iron (Applicable to both eutectic solder and Lead(Pb)-Free solder)

Complete soldering within 10 seconds for lead temperature not exceeding 260 deg.C or within 3 seconds

not exceeding 350 deg.C.

Heating by soldering iron must be only once per 1 lead

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste type

used

by

the

customer

within

the

described profile.

This profile is based on the device’s

maximum heat resistance guaranteed

value.

Set the preheat temperature/heating

temperature to the optimum temperature

corresponding to the solder paste type

used

by

the

customer

within

the

described profile.