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AD7304BR-REEL Datasheet(PDF) 18 Page - Analog Devices

Part No. AD7304BR-REEL
Description  3 V/5 V, Rail-to-Rail Quad, 8-Bit DAC
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Maker  AD [Analog Devices]
Homepage  http://www.analog.com
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AD7304BR-REEL Datasheet(HTML) 18 Page - Analog Devices

 
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 18 / 20 page
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AD7304/AD7305
Rev. C | Page 18 of 20
OUTLINE DIMENSIONS
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AA
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
16
9
8
1
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
10.50 (0.4134)
10.10 (0.3976)
0.75 (0.0295)
0.25 (0.0098)
× 45°
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
COPLANARITY
0.10
Figure 39. 16-Lead Standard Small Outline Package [SOIC]
Wide Body (R-16)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AC
0.75 (0.0295)
0.25 (0.0098)
20
11
10
1
× 45°
1.27 (0.0500)
0.40 (0.0157)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
0.33 (0.0130)
0.20 (0.0079)
1.27
(0.0500)
BSC
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
13.00 (0.5118)
12.60 (0.4961)
COPLANARITY
0.10
Figure 40. 20-Lead Standard Small Outline Package [SOIC]
Wide Body (R-20)
Dimensions shown in millimeters and (inches)
16
9
8
1
PIN 1
SEATING
PLANE
4.50
4.40
4.30
6.40
BSC
5.10
5.00
4.90
0.65
BSC
0.15
0.05
1.20
MAX
0.20
0.09
0.75
0.60
0.45
0.30
0.19
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AB
Figure 41. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
20
1
11
10
6.40 BSC
4.50
4.40
4.30
PIN 1
6.60
6.50
6.40
SEATING
PLANE
0.15
0.05
0.30
0.19
0.65
BSC
1.20 MAX
0.20
0.09
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153AC
COPLANARITY
0.10
Figure 42. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters


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