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CSD97374Q4M Datasheet(PDF) 1 Page - Texas Instruments |
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CSD97374Q4M Datasheet(HTML) 1 Page - Texas Instruments |
1 / 18 page 0 5 10 15 20 25 40 50 60 70 80 90 100 0 2 4 6 8 10 12 Output Current (A) VGS = 5V VIN = 12V VOUT = 1.8V LOUT = .29µH fSW = 500kHz TA = 25ºC G001 CSD97374Q4M www.ti.com SLPS382C – JANUARY 2013 – REVISED JULY 2013 Synchronous Buck NexFET™ Power Stage 1 FEATURES APPLICATIONS 23 • Over 92% System Efficiency at 15A • Ultrabook/Notebook DC/DC Converters • Max Rated Continuous Current 25A, Peak 60A • Multiphase Vcore and DDR Solutions • High Frequency Operation (up to 2 MHz) • Point-of-Load Synchronous Buck in Networking, Telecom, and Computing Systems • High Density - SON 3.5x4.5-mm Footprint • Ultra Low Inductance Package ORDERING INFORMATION • System Optimized PCB Footprint Device Package Media Qty Ship • Ultra Low Quiescent (ULQ) Current Mode SON 3.5 × 4.5-mm 13-Inch Tape and CSD97374Q4M 2500 Plastic Package Reel Reel • 3.3V and 5V PWM Signal Compatible • Diode Emulation Mode with FCCM • Input Voltages up to 24V • Three-State PWM Input • Integrated Bootsrap Diode • Shoot Through Protection • RoHS Compliant – Lead Free Terminal Plating • Halogen Free DESCRIPTION The CSD97374Q4M NexFET™ Power Stage is a highly optimized design for use in a high power, high density Synchronous Buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows™ 8 . With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design. Figure 1. Application Diagram Figure 2. Efficiency and Power Loss 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. 2 NexFET is a trademark of Texas Instruments. 3 All other trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Copyright © 2013, Texas Instruments Incorporated Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. |
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