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XFGM-3001MPGSR Datasheet(PDF) 5 Page - Fujikura Ltd. |
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XFGM-3001MPGSR Datasheet(HTML) 5 Page - Fujikura Ltd. |
5 / 5 page Pre-amplified/5V Excitation/Gauge XFGM Data sheet 5 Reflow Soldering process recommendation profile a: Rump up rate 1 or 2 deg.C/sec. b: Pre-heating 150 to 180 deg.C,within 60 to120sec. c: Rump up rate 1 to 2 deg.C/sec. d: Heating max.230 deg.C,max.10sec. 210 deg.C,within 30sec. e: Rump down rate 1 or 2 deg.C/sec. Note ; 1 ) Temperature means Surface temperature of the sensor package. 2 ) Reflow process max. 2 times. 3 ) Do not wash the sensor. 4 ) Do not put the solder and flux on the sensor package. If you have any questions regarding technical issues or specifications, please contact us. Fujikura Ltd. Sensor Department 5-1 Kiba 1-chome, Koto-ku, Tokyo 135-8512, Japan Phone +81-(0)3-5606-1072 E-mail : sensor@fujikura.co.jp Package Surface Temperature (Degree C) 210 150 Room Temp. a b c d e 230 Time |
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