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PBSS4112PAN Datasheet(PDF) 3 Page - NXP Semiconductors

Part # PBSS4112PAN
Description  120 V, 1 A NPN/NPN low VCEsat (BISS) transistor
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Manufacturer  NXP [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo NXP - NXP Semiconductors

PBSS4112PAN Datasheet(HTML) 3 Page - NXP Semiconductors

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NXP Semiconductors
PBSS4112PAN
120 V, 1 A NPN/NPN low VCEsat (BISS) transistor
PBSS4112PAN
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved
Product data sheet
29 November 2012
3 / 17
Symbol
Parameter
Conditions
Min
Max
Unit
IBM
peak base current
single pulse; tp ≤ 1 ms
-
1
A
[1]
-
370
mW
[2]
-
570
mW
[3]
-
530
mW
[4]
-
700
mW
[5]
-
450
mW
[6]
-
760
mW
[7]
-
700
mW
Ptot
total power dissipation
Tamb ≤ 25 °C
[8]
-
1450
mW
Per device
[1]
-
510
mW
[2]
-
780
mW
[3]
-
730
mW
[4]
-
960
mW
[5]
-
620
mW
[6]
-
1040
mW
[7]
-
960
mW
Ptot
total power dissipation
Tamb ≤ 25 °C
[8]
-
2000
mW
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1] Device mounted on an FR4 PCB, single-sided 35 µm copper strip line, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided 35 µm copper strip line, tin-plated, mounting pad for
collector 1 cm2.
[3] Device mounted on 4-layer PCB 35 µm copper strip line, tin-plated and standard footprint.
[4] Device mounted on 4-layer PCB 35 µm copper strip line, tin-plated, mounting pad for collector 1 cm2.
[5] Device mounted on an FR4 PCB, single-sided 70 µm copper strip line, tin-plated and standard footprint.
[6] Device mounted on an FR4 PCB, single-sided 70 µm copper strip line, tin-plated, mounting pad for
collector 1 cm2.
[7] Device mounted on 4-layer PCB 70 µm copper strip line, tin-plated and standard footprint.
[8] Device mounted on 4-layer PCB 70 µm copper strip line, tin-plated, mounting pad for collector 1 cm2.


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