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MM74HCT240 Datasheet(PDF) 1 Page - Fairchild Semiconductor |
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MM74HCT240 Datasheet(HTML) 1 Page - Fairchild Semiconductor |
1 / 7 page © 1999 Fairchild Semiconductor Corporation DS005365 www.fairchildsemi.com February 1984 Revised July 1999 MM74HCT240 • MM74HCT244 Inverting Octal 3-STATE Buffer • Octal 3-STATE Buffer General Description The MM74HCT240 and MM74HCT244 3-STATE buffers utilize advanced silicon-gate CMOS technology and are general purpose high speed inverting and non-inverting buffers. They possess high drive current outputs which enable high speed operation even when driving large bus capacitances. These circuits achieve speeds comparable to low power Schottky devices, while retaining the low power consumption of CMOS. All three devices are TTL input compatible and have a fanout of 15 LS-TTL equiva- lent inputs. MM74HCT devices are intended to interface between TTL and NMOS components and standard CMOS devices. These parts are also plug-in replacements for LS-TTL devices and can be used to reduce power consumption in existing designs. The MM74HCT240 is an inverting buffer and the MM74HCT244 is a non-inverting buffer. Each device has two active low enables (1G and 2G), and each enable inde- pendently controls 4 buffers. All inputs are protected from damage due to static dis- charge by diodes to VCC and Ground. Features s TTL input compatible s Typical propagation delay: 14 ns s 3-STATE outputs for connection to system buses s Low quiescent current: 80 µA s High output drive current: 6 mA (min) Ordering Code: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code. Connection Diagrams Pin Assignments for DIP, SOIC, SOP and TSSOP Top View MM74HCT240 Top View MM74HCT244 Order Number Package Number Package Description MM74HCT240WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide MM74HCT240SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT240MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HCT240N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide MM74HCT244WM M20B 20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300” Wide MM74HCT244SJ M20D 20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HCT244MTC MTC20 20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide MM74HCT244N N20A 20-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300” Wide |
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