©2001 Fairchild Semiconductor Corporation

FGH30N6S2D / FGP30N6S2D / FGB30NS2D Rev. A

TO-247

3 LEAD JEDEC STYLE TO-247 PLASTIC PACKAGE

A

b

c

D

E

L

ØR

12

31

ØS

Q

ØP

BACK VIEW

TERM. 4

3

e

2

SYMBOL

INCHES

MILLIMETERS

NOTES

MIN

MAX

MIN

MAX

A

0.180

0.190

4.58

4.82

-

b

0.046

0.051

1.17

1.29

2, 3

0.060

0.070

1.53

1.77

1, 2

0.095

0.105

2.42

2.66

1, 2

c

0.020

0.026

0.51

0.66

1, 2, 3

D

0.800

0.820

20.32

20.82

-

E

0.605

0.625

15.37

15.87

-

e

0.219 TYP

5.56 TYP

4

0.438 BSC

11.12 BSC

4

0.090

0.105

2.29

2.66

5

L

0.620

0.640

15.75

16.25

-

0.145

0.155

3.69

3.93

1

ØP

0.138

0.144

3.51

3.65

-

Q

0.210

0.220

5.34

5.58

-

ØR

0.195

0.205

4.96

5.20

-

ØS

0.260

0.270

6.61

6.85

-

NOTES:

2. Lead dimension (without solder).

3. Add typically 0.002 inches (0.05mm) for solder coating.

4. Position of lead to be measured 0.250 inches (6.35mm) from bottom of di-

mension D.

5. Position of lead to be measured 0.100 inches (2.54mm) from bottom of di-

mension D.

6. Controlling dimension: Inch.

7. Revision 1 dated 1-93.