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STM1816SWX7F Datasheet(PDF) 17 Page - STMicroelectronics |
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STM1816SWX7F Datasheet(HTML) 17 Page - STMicroelectronics |
17 / 25 page STM1810/1811/1812/1813/1815/1816/1817/1818 Maximum rating Doc ID11464 Rev 8 17/25 4 Maximum rating Stressing the device above the rating listed in Table 7 may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the “Operating” sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics™ “SURE Program” and other relevant quality documents. Table 7. Absolute maximum ratings Symbol Parameter Value Unit TSTG Storage temperature (VCC Off) –55 to 150 °C TSLD (1) 1. Reflow at peak temperature of 255 °C to 260 °C for < 30 seconds (total thermal budget not to exceed 180 °C for between 90 to 150 seconds). Lead solder temperature for 10 seconds 260 °C VIO Input or output voltage –0.3 to VCC +0.3 V VCC Supply voltage –0.3 to 7.0 V IO Output current 20 mA PD Power dissipation 320 mW |
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Similar Description - STM1816SWX7F |
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