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STPS8L30 Datasheet(PDF) 4 Page - STMicroelectronics |
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STPS8L30 Datasheet(HTML) 4 Page - STMicroelectronics |
4 / 7 page Packaging information STPS8L30 4/7 2 Packaging information Figure 9. Forward voltage drop versus forward current Figure 10. Thermal resistance junction to ambient versus copper surface under tab (epoxy printed board FR4, Cu = 35 µm) (DPAK) I (A) FM V (V) FM T =25°C (maximum values) j T =125°C (maximum values) j T =150°C (typical values) j 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 0.1 1.0 10.0 100.0 02 46 8 10 12 14 16 18 20 0 20 40 60 80 100 R (°C/W) th(j-a) S(mm²) Table 4. DPAK dimensions REF. DIMENSIONS Millimeters Inches Min. Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L2 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° H L4 G B L2 E B2 D A1 R R C A C2 0.60 MIN. V2 A2 |
Similar Part No. - STPS8L30_06 |
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Similar Description - STPS8L30_06 |
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