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1500457 Datasheet(PDF) 77 Page - Freescale Semiconductor, Inc

Part No. 1500457
Description  Integrated Host Processor Hardware Specifications
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Manufacturer  FREESCALE [Freescale Semiconductor, Inc]
Direct Link  http://www.freescale.com
Logo FREESCALE - Freescale Semiconductor, Inc

1500457 Datasheet(HTML) 77 Page - Freescale Semiconductor, Inc

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MPC8349EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 13
Freescale Semiconductor
77
Thermal
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device-related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
The thermal performance of devices with heat sinks has been simulated with a few commercially available
heat sinks. The heat sink choice is determined by the application environment (temperature, air flow,
adjacent component power dissipation) and the physical space available. Because there is not a standard
application environment, a standard heat sink is not required.
Table 64 shows heat sink thermal resistance for TBGA of the MPC8349EA.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Table 64. Heat Sink and Thermal Resistance of MPC8349EA (TBGA)
Heat Sink Assuming Thermal Grease
Air Flow
35
× 35 mm TBGA
Thermal Resistance
AAVID 30
× 30 × 9.4 mm pin fin
Natural convection
10
AAVID 30
× 30 × 9.4 mm pin fin
1 m/s
6.5
AAVID 30
× 30 × 9.4 mm pin fin
2 m/s
5.6
AAVID 31
× 35 × 23 mm pin fin
Natural convection
8.4
AAVID 31
× 35 × 23 mm pin fin
1 m/s
4.7
AAVID 31
× 35 × 23 mm pin fin
2 m/s
4
Wakefield, 53
× 53 × 25 mm pin fin
Natural convection
5.7
Wakefield, 53
× 53 × 25 mm pin fin
1 m/s
3.5
Wakefield, 53
× 53 × 25 mm pin fin
2 m/s
2.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
Natural convection
6.7
MEI, 75
× 85 × 12 no adjacent board, extrusion
1 m/s
4.1
MEI, 75
× 85 × 12 no adjacent board, extrusion
2 m/s
2.8
MEI, 75
× 85 × 12 mm, adjacent board, 40 mm side bypass
1 m/s
3.1


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