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PSMN3R2-30YLC Datasheet(PDF) 4 Page - NXP Semiconductors

Part # PSMN3R2-30YLC
Description  NextPower 25 V & 30 V MOSFETs in LFPAK(Power-SO8)
Download  8 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PSMN3R2-30YLC Datasheet(HTML) 4 Page - NXP Semiconductors

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NextPower MOSFETs - Visit us at www.nxp.com/mosfets
NextPower types – parametric data
The 25 V and 30 V types shown below are recommended for synchronous buck regulators, the low R
DS(on) types are also highly
recommended for Power OR-ing applications and low voltage isolated power supply topologies.
Type
Voltage (V)
R
DS(on)typ
V
GS = 4.5 V (mΩ)
Q
G(typ)
V
GS = 4.5 V (nC)
Q
GD(typ)
V
GS = 4.5 V (nC)
C
OSS (pF)
PSMN0R9-25YLC
25
0.95
51
14
1437
PSMN1R1-25YLC
25
1.2
39
11
1121
PSMN1R2-25YLC
25
1.35
31
8.3
994
PSMN1R7-25YLC
25
2
28
7.8
880
PSMN1R9-25YLC
25
2.2
27
7.4
761
PSMN2R2-25YLC
25
2.6
18
5.2
617
PSMN2R9-25YLC
25
3.45
16
4.4
501
PSMN3R2-25YLC
25
3.7
14
4
462
PSMN3R7-25YLC
25
4.25
10.1
3
370
PSMN4R0-25YLC
25
4.5
10.9
3.5
354
25 V NextPower types
NextPower MOSFETs use ‘Superjunction’ silicon technology to
deliver the optimum balance between low R
DS, low QG(tot), low
Q
GD, high SOA performance and low Coss at 25 V and 30 V.
Superjunction technology combines the benefits of a lateral
MOSFET, (low Q
g(tot) and low QGD) with the benefits of a
Trench-MOSFET (low R
DS(on) and 20 V rugged GATE rating)
resulting in a uniquely balanced specification.
NextPower uses an optimized balance of the different
resistance elements in the MOSFET to achieve a lower
on-resistance for every cell. The low cell resistance means that
NextPower types typically require fewer cells than competitor
devices to achieve the same R
DS(on), and a lower cell count
provides lower Q
G(tot), low QGD, low Coss and superior ‘Safe
operating area’ ruggedness.
NextPower technology uses p-Type
pillars to improve the breakdown
voltage in the OFF state, and a heavily
doped n-Type drift region to achieve
exceptionally low ON resistance.
Since fewer cells are required to
achieve a given R
DS rating, then gate
charge (Q
G), Miller charge (QGD),
output capacitance (C
oss) are all
reduced and optimum ruggedness
(denoted by the safe operating area
characteristics) is achieved.
Superjunction technology
Drain
p-Type
PILLARS
n-Type
DRIFT REGION
n+
Gate
p-Body
Source


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