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443424 Datasheet(PDF) 6 Page - YAGEO Corporation

Part No. 443424
Description  ARRAY CHIP RESISTORS
Download  8 Pages
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Manufacturer  YAGEO [YAGEO Corporation]
Direct Link  http://www.yageo.com
Logo YAGEO - YAGEO Corporation

443424 Datasheet(HTML) 6 Page - YAGEO Corporation

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SERIES
YC/TC
164 (RoHS Compliant)
Chip Resistor Surface Mount
www.yageo.com
Oct 27, 2008 V.3
Product specification
6
8
TESTS AND REQUIREMENTS
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Life/
Operational Life/
Endurance
MIL-STD-202G-method 108A
IEC 60115-1 4.25.1
JIS C 5202-7.10
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
±(2%+0.05 Ω)
<100 mΩ for Jumper
High
Temperature
Exposure/
Endurance at
upper category
temperature
MIL-STD-202G-method 108A
IEC 60115-1 4.25.3
JIS C 5202-7.11
1,000 hours at maximum operating temperature
depending on specification, unpowered
No direct impingement of forced air to the parts
Tolerances: 155±3 °C
±(1%+0.05 Ω)
<50 mΩ for Jumper
Moisture
Resistance
MIL-STD-202G-method 106F
IEC 60115-1 4.24.2
Each temperature / humidity cycle is defined at 8
hours (method 106F), 3 cycles / 24 hours for 10d
with 25 °C / 65 °C 95% R.H, without steps 7a &
7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
±(2%+0.05 Ω)
<100 mΩ for Jumper
Thermal Shock
MIL-STD-202G-method 107G
-55/+155 °C
Note: Number of cycles required is 300. Devices
unmounted
Maximum transfer time is 20 seconds. Dwell time
is 15 minutes. Air – Air
±(0.5%+0.05 Ω) for 10 KΩ to
10 MΩ
±(1%+0.05 Ω) for others
<50 mΩ for Jumper
Short time
overload
MIL-R-55342D-para 4.7.5
IEC60115-1 4.13
2.5 times RCWV or maximum overload voltage
whichever is less for 5 sec at room temperature
±(2%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Board Flex/
Bending
IEC60115-1 4.33
Device mounted on PCB test board as described,
only 1 board bending required
3 mm bending
Bending time: 60±5 seconds
Ohmic value checked during bending
±(1%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Table 4 Test condition, procedure and requirements


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