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AXK6S30647YG Datasheet(PDF) 10 Page - Panasonic Semiconductor |
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AXK6S30647YG Datasheet(HTML) 10 Page - Panasonic Semiconductor |
10 / 15 page Panasonic Corporation Automation Controls Business Division industrial.panasonic.com/ac/e/ AXK(5(S)/6(S)) ACCTB22E 201303-T NOTES 1. Prevention of reverse mating Other than P5KS series 120, 130, 160 pin contacts type, the socket and header are protected from reverse mating by a molded resin key. Excessive mating force may damage the key, so be sure to match chamfered corners when mating. 2. Recommended PC board and metal mask patterns Connectors are mounted with high pitch density, intervals of 0.35 mm, 0.4 mm or 0.5 mm. In order to reduce solder and flux rise, solder bridges and other issues make sure the proper levels of solder is used. The figures to the right are recommended metal mask patterns. Please use them as a reference. Chamfered corner Chamfered corner Chamfered corner Chamfered corner Outline (top view) Chamfered corner Mating state • P5K Socket Recommended PC board pattern (TOP VIEW) Recommended metal mask pattern Metal mask thickness: When 150 µm (Opening area ratio: 56%) Recommended metal mask pattern Metal mask thickness: When 120 µm (Opening area ratio: 69%) 0.50 ±0.05 0.50 ±0.05 0.25 ±0.05 B ±0.05 0.75 ±0.05 0.125 ±0.05 0.23 ±0.01 0.115 ±0.01 0.35 ±0.01 0.50 ±0.01 0.50 ±0.01 B ±0.01 0.50 ±0.01 0.50 ±0.01 0.23 ±0.01 0.115 ±0.01 0.35 ±0.01 B ±0.01 • P5K Header Recommended PC board pattern (TOP VIEW) Recommended metal mask pattern Metal mask thickness: When 150 µm (Opening area ratio: 62%) Recommended metal mask pattern Metal mask thickness: When 120 µm (Opening area ratio: 78%) 0.50 ±0.05 0.50 ±0.05 0.25 ±0.05 0.75 ±0.05 B ±0.05 0.125 ±0.05 0.23 ±0.01 0.115 ±0.01 0.35 ±0.01 0.50 ±0.01 0.50 ±0.01 B ±0.01 0.50 ±0.01 0.50 ±0.01 0.23 ±0.01 0.115 ±0.01 0.35 ±0.01 B ±0.01 * See the dimension table on page 93 for more information on the B dimension of the socket and header. |
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