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ADXL335BCPZ-RL7 Datasheet(PDF) 13 Page - Analog Devices

Part No. ADXL335BCPZ-RL7
Description  Small, Low Power, Accelerometer
Download  16 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

ADXL335BCPZ-RL7 Datasheet(HTML) 13 Page - Analog Devices

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ADXL335
Rev. B | Page 13 of 16
LAYOUT AND DESIGN RECOMMENDATIONS
The recommended soldering profile is shown in Figure 25 followed by a description of the profile features in Table 6. The recommended
PCB layout or solder land drawing is shown in Figure 26.
tP
tL
t25°C TO PEAK
tS
PREHEAT
CRITICAL ZONE
TL TO TP
TIME
RAMP-DOWN
RAMP-UP
TSMIN
TSMAX
TP
TL
Figure 25. Recommended Soldering Profile
Table 6. Recommended Soldering Profile
Profile Feature
Sn63/Pb37
Pb-Free
Average Ramp Rate (TL to TP)
3°C/sec max
3°C/sec max
Preheat
Minimum Temperature (TSMIN)
100°C
150°C
Maximum Temperature (TSMAX)
150°C
200°C
Time (TSMIN to TSMAX)(tS)
60 sec to 120 sec
60 sec to 180 sec
TSMAX to TL
Ramp-Up Rate
3°C/sec max
3°C/sec max
Time Maintained Above Liquidous (TL)
Liquidous Temperature (TL)
183°C
217°C
Time (tL)
60 sec to 150 sec
60 sec to 150 sec
Peak Temperature (TP)
240°C + 0°C/−5°C
260°C + 0°C/−5°C
Time Within 5°C of Actual Peak Temperature (tP)
10 sec to 30 sec
20 sec to 40 sec
Ramp-Down Rate
6°C/sec max
6°C/sec max
Time 25°C to Peak Temperature
6 minutes max
8 minutes max
EXPOSED PAD IS NOT
INTERNALLY CONNECTED
BUT SHOULD BE SOLDERED
FOR MECHANICAL INTEGRITY.
0.50
MAX
0.65
0.325
1.95
0.65
0.325
4
4
0.35
MAX
1.95
DIMENSIONS SHOWN IN MILLIMETERS
Figure 26. Recommended PCB Layout


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