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TC2014-2.6VCTTR Datasheet(PDF) 3 Page - Microchip Technology

Part # TC2014-2.6VCTTR
Description  50 mA, 100 mA, 150 mA CMOS LDOs
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Manufacturer  MICROCHIP [Microchip Technology]
Direct Link  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

TC2014-2.6VCTTR Datasheet(HTML) 3 Page - Microchip Technology

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 2001-2012 Microchip Technology Inc.
DS21662F-page 3
TC2014/2015/2185
TEMPERATURE CHARACTERISTICS
Thermal Regulation
V
OUT/PD
—0.04
V/W
Note 6, Note 7
Thermal Shutdown Die
Temperature
TSD
160
°C
Output Noise
eN
200
nV/
Hz I
L = IOUTMAX, F = 10 kHz
470 pF from Bypass to GND
Response Time
(from Shutdown Mode)
(Note 8)
TR
—60—
µs
VIN = 4V, IL = 30 mA,
CIN = 1 µF, COUT = 10 µF
SHDN Input
SHDN Input High
Threshold
VIH
60
——
%VIN
VIN = 2.5V to 6.0V
SHDN Input Low
Threshold
VIL
——
15
%VIN
VIN = 2.5V to 6.0V
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, VIN = VR + 1V, IL = 100 µA, COUT = 3.3 µF, SHDN > VIH, TA = +25°C.
BOLDFACE type specifications apply for junction temperature of -40°C to +125°C.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Note
1: The minimum VIN has to meet two conditions: VIN = 2.7V and VIN = VR + VDROPOUT.
2: VR is the regulator output voltage setting. For example: VR = 1.8V, 2.7V, 2.8V, 2.85V, 3.0V, 3.3V.
3:
4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 1.0 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the Thermal Regulation specification.
5: Dropout Voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value.
6: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to IMAX at VIN = 6V for T = 10 ms.
7: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e. TA, TJ, JA).
8: Time required for VOUT to reach 95% of VR (output voltage setting), after VSHDN is switched from 0 to VIN.
TCV
OUT
V
OUTMAX
V
OUTMIN
 10
6
V
OUT
T
----------------------------------------------------------------------------
=
Electrical Specifications: Unless otherwise noted, VDD = +2.7V to +6.0V and VSS = GND.
Parameters
Sym
Min
Typ
Max
Units
Conditions
Temperature Ranges:
Extended Temperature Range
TA
-40
+125
°C
Operating Temperature Range
TA
-40
+125
°C
Storage Temperature Range
TA
-65
+150
°C
Thermal Package Resistances:
Thermal Resistance, 5L-SOT-23
JA
—255
°C/W


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