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H5TQ1G63DFR Datasheet(PDF) 7 Page - Hynix Semiconductor

Part # H5TQ1G63DFR
Description  1Gb DDR3 SDRAM
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Manufacturer  HYNIX [Hynix Semiconductor]
Direct Link  http://www.skhynix.com/kor/main.do
Logo HYNIX - Hynix Semiconductor

H5TQ1G63DFR Datasheet(HTML) 7 Page - Hynix Semiconductor

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Rev. 1.1 /Jan. 2011
7
DM, (DMU),
(DML)
Input
Input Data Mask: DM is an input mask signal for write data. Input data is masked when
DM is sampled HIGH coincident with that input data during a Write access. DM is sampled
on both edges of DQS. For x8 device, the function of DM or TDQS/TDQS is enabled by
Mode Register A11 setting in MR1.
BA0 - BA2
Input
Bank Address Inputs: BA0 - BA2 define to which bank an Active, Read, Write or Precharge
command is being applied. Bank address also determines which mode register is to be
accessed during a MRS cycle.
A0 - A15
Input
Address Inputs: Provide the row address for Active commands and the column address for
Read/Write commands to select one location out of the memory array in the respective
bank. (A10/AP and A12/BC have additional functions, see below).
The address inputs also provide the op-code during Mode Register Set commands.
A10 / AP
Input
Auto-precharge: A10 is sampled during Read/Write commands to determine whether
Autoprecharge should be performed to the accessed bank after the Read/Write operation.
(HIGH: Autoprecharge; LOW: no Autoprecharge).A10 is sampled during a Precharge
command to determine whether the Precharge applies to one bank (A10 LOW) or all
banks (A10 HIGH). If only one bank is to be precharged, the bank is selected by bank
addresses.
A12 / BC
Input
Burst Chop: A12 / BC is sampled during Read and Write commands to determine if burst
chop (on-the-fly) will be performed.
(HIGH, no burst chop; LOW: burst chopped). See command truth table for details.
RESET
Input
Active Low Asynchronous Reset: Reset is active when RESET is LOW, and inactive when
RESET is HIGH. RESET must be HIGH during normal operation.
RESET is a CMOS rail-to-rail signal with DC high and low at 80% and 20% of VDD, i.e.
1.20V for DC high and 0.30V for DC low.
DQ
Input /
Output
Data Input/ Output: Bi-directional data bus.
DQU, DQL,
DQS, DQS,
DQSU, DQSU,
DQSL, DQSL
Input /
Output
Data Strobe: output with read data, input with write data. Edge-aligned with read data,
centered in write data. The data strobe DQS, DQSL, and DQSU are paired with differential
signals DQS, DQSL, and DQSU, respectively, to provide differential pair signaling to the
system during reads and writes. DDR3 SDRAM supports differential data strobe only and
does not support single-ended.
NC
No Connect: No internal electrical connection is present.
NF
No Function
VDDQ
Supply DQ Power Supply: 1.5V +/- 0.075V
VSSQ
Supply DQ Ground
VDD
Supply Power Supply: 1.5V +/- 0.075V
VSS
Supply Ground
VREFDQ
Supply Reference voltage for DQ
VREFCA
Supply Reference voltage for CA
ZQ
Supply Reference Pin for ZQ calibration
Symbol
Type
Function


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