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FH36W-25S-03SHW Datasheet(PDF) 7 Page - Hirose Electric |
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FH36W-25S-03SHW Datasheet(HTML) 7 Page - Hirose Electric |
7 / 12 page 7 FH36 Seriesq0.3 mm Pitch, 1.0 mm above the board Flexible Printed Circuit ZIF Connectors sTemperature Profile HRS test condition Solder method :Reflow, IR/hot air Environment :Room air Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Senju Metal Industry, Co., Ltd.'s Part Number:M705-221CM5-32-10.5) Test board :Glass epoxy 25mm∞50mm∞0.8mm thick Land dimensions :0.3mm∞0.6mm, 0.3mm∞0.8mm Metal mask :0.23∞0.5, 0.23∞0.65∞0.1mm thick The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. 25ç (60sec.) (60sec.) 90 sec. to 120 sec. Preheating Soldering Start (ç) 0 50 100 150 200 250 MAX 250ç Time (Seconds) 150ç 200ç 230ç qUsing Lead-free Solder Paste The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. |
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