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FH41-31S-03SHW Datasheet(PDF) 7 Page - Hirose Electric |
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FH41-31S-03SHW Datasheet(HTML) 7 Page - Hirose Electric |
7 / 10 page 7 FH42 Series●0.3 mm Pitch, 0.65 mm above the board, Top Contact, Back-Flip actuator Flexible Printed Circuit ZIF Connectors ■ Temperature Profile ● Using Lead-free Solder Paste HRS test condition Solder method :Reflow, IR/hot air Environment :Room air Solder composition :Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Senju Metal Industry, Co., Ltd.'s Part Number:M705-GRN360-K2-V) Test board :Glass epoxy 25mm×50mm×0.8mm thick Land dimensions :0.28mm×0.6mm,0.28mm×0.9mm Metal mask :0.26×0.48,0.26×0.73×0.1mm thick The temperature profiles shown are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume / thickness and board size / thickness. Consult your solder paste and equipment manufacturer for specific recommendations. MAX 250ç Start Time(Seconds) 25ç (60sec.) (60sec.) 90 sec. to 120 sec. Preheating soldering 0 50 100 150 150ç 200ç 230ç 200 250 (ç) The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. |
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