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BAS40L Datasheet(PDF) 14 Page - NXP Semiconductors |
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BAS40L Datasheet(HTML) 14 Page - NXP Semiconductors |
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14 / 21 page  BAS40_1PSXXSB4X_SER_8 © NXP B.V. 2010. All rights reserved. Product data sheet Rev. 08 — 13 January 2010 14 of 21 NXP Semiconductors BAS40 series; 1PSxxSB4x series General-purpose Schottky diodes Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 20. Reflow soldering footprint SOD123F Reflow soldering is the only recommended soldering method. Dimensions in mm Fig 21. Reflow soldering footprint SOD882 1.6 1.6 2.9 4 4.4 1.1 1.2 2.1 1.1 (2 ×) solder lands solder resist occupied area solder paste mbl872 1.30 0.30 R = 0.05 (8 ×) R = 0.05 (8 ×) 0.60 (2 ×) 0.70 (2 ×) 0.80 (2 ×) 0.90 0.30 (2 ×) 0.40 (2 ×) 0.50 (2 ×) solder lands solder resist occupied area solder paste |
Similar Part No. - BAS40L |
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Similar Description - BAS40L |
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