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BD10IC0WHFV-GTR Datasheet(PDF) 16 Page - Rohm

Description  1A Variable Fixed Output LDO Regulators
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Maker  ROHM [Rohm]
Homepage  http://www.rohm.com
Logo ROHM - Rohm

BD10IC0WHFV-GTR Datasheet(HTML) 16 Page - Rohm

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© 2012 ROHM Co., Ltd. All rights reserved.
21.Dec.2012 Rev.002
Thermal design should ensure operation within the following conditions. Note that the temperatures listed are the allowed
temperature limits and thermal design should allow sufficient margin beyond these limits.
1. Ambient temperature Ta can be no higher than 85℃.
2. Chip junction temperature (Tj) can be no higher than 150℃.
Chip junction temperature can be determined as follows:
Calculation based on ambient temperature (Ta)
<Reference values>
θj-a:HTSOP-J8 153.2℃/W
1-layer substrate (copper foil density 0mm×0mm)
2-layer substrate (copper foil density 15mm×15mm)
2-layer substrate (copper foil density 70mm×70mm)
4-layer substrate (copper foil density 70mm×70mm)
Substrate size: 70mm×70mm×1.6mm (substrate with thermal via)
Most of the heat loss that occurs in the BDxxIC0W series is generated from the output Pch FET. Power loss is determined by
the total VCC-VO voltage and output current. Be sure to confirm the system input and output voltage as well as the output current
conditions in relation to the heat dissipation characteristics of the VCC and VO in the design. Bearing in mind that heat dissipation
may vary substantially depending on the substrate employed (due to the power package incorporated in the BDxxIC0W
series )make certain to factor conditions such as substrate size into the thermal design.
Power consumption [W] =
Input voltage (VCC) - Output voltage (VO)
Example) When VCC=3.3V, VO=2.5V, IO(Ave) = 0.1A
Power consumption [W] =
3.3V - 2.5V

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