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BD10IC0WHFV-GTR Datasheet(PDF) 15 Page - Rohm |
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BD10IC0WHFV-GTR Datasheet(HTML) 15 Page - Rohm |
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15/23 BDxxIC0WEFJ / BDxxIC0WHFV Datasheet TSZ02201-0R6R0A600430-1-2 © 2012 ROHM Co., Ltd. All rights reserved. www.rohm.com TSZ22111･15･001 21.Dec.2012 Rev.002 ●Power Dissipation ◎HTSOP-J8 ◎HVSOF6 Measurement condition: mounted on a ROHM board, Substrate size: 70mm × 70mm × 1.6mm (Substrate with thermal via) ・Solder the thermal pad to Ground ① IC only θj-a=249.5℃/W ② 1-layer（copper foil are :0mm×0mm） θj-a=153.2℃/W ③ 2-layer（copper foil are :15mm×15mm） θj-a=113.6℃/W ④ 2-layer（copper foil are :70mm×70mm） θj-a=59.2℃/W ⑤ 4-layer（copper foil are :70mm×70mm） θj-a=33.3℃/W 0 25 50 75 100 125 150 0 2.0 3.0 4.0 ①0.50W 周囲温度:Ta [℃] 1.0 ①0.50W ②0.82W ③1.10W ④2.11W ⑤3.76W Ambient Temperature :Ta [℃] Measurement condition: mounted on a ROHM board, Substrate size: 70mm × 70mm × 1.6mm (Substrate with thermal via) ・Solder the thermal pad to Ground ① single-layer(copper foil are :2%) θj-a=147.1℃/W ② single-layer(copper foil are :18%) θj-a=89.3℃/W ③single-layer(copper foil are :51%) θj-a=73.5℃/W 0.0 1.0 2.0 3.0 4.0 0 25 50 75 100 125 150 Ambient Tempera ture: Ta [℃] ③1.7W ②1.4W ①0.85W |
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