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CR0805-BI-8552ELF Datasheet(PDF) 7 Page - Bourns Electronic Solutions |
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CR0805-BI-8552ELF Datasheet(HTML) 7 Page - Bourns Electronic Solutions |
7 / 8 page Chip Array vs DIP Package Chip Array • Ceramic has protective coating on top • Terminate to metallization on ceramic • Low power DIP Package • Ceramic covered with molding • Terminate to pins connected to ceramic • Higher power rating than chip array Chip Resistor and Chip Array Applications • Test equipment • Consumer electronics • Appliances • Telecommunications • Hand-held electronics • Office equipment • Industrial equipment • Small signal instrumentation • DC/DC converters in power modules |
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