LTC2912

11

2912fa

Information furnished by Linear Technology Corporation is believed to be accurate and reliable.

However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-

tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.

PACKAGE DESCRIPTION

DDB Package

8-Lead Plastic DFN (3mm × 2mm)

(Reference LTC DWG # 05-08-1702 Rev B)

TS8 Package

8-Lead Plastic TSOT-23

(Reference LTC DWG # 05-08-1637)

2.00 ±0.10

(2 SIDES)

NOTE:

1. DRAWING CONFORMS TO VERSION (WECD-1) IN JEDEC PACKAGE OUTLINE M0-229

2. DRAWING NOT TO SCALE

3. ALL DIMENSIONS ARE IN MILLIMETERS

4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE

MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE

5. EXPOSED PAD SHALL BE SOLDER PLATED

6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE

0.40 ± 0.10

BOTTOM VIEW—EXPOSED PAD

0.56 ± 0.05

(2 SIDES)

0.75 ±0.05

R = 0.115

TYP

R = 0.05

TYP

2.15 ±0.05

(2 SIDES)

3.00 ±0.10

(2 SIDES)

1

4

8

5

PIN 1 BAR

TOP MARK

(SEE NOTE 6)

0.200 REF

0 – 0.05

(DDB8) DFN 0905 REV B

0.25 ± 0.05

0.50 BSC

PIN 1

R = 0.20 OR

0.25 × 45°

CHAMFER

0.25 ± 0.05

2.20 ±0.05

(2 SIDES)

RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS

0.61 ±0.05

(2 SIDES)

1.15 ±0.05

0.70 ±0.05

2.55 ±0.05

PACKAGE

OUTLINE

0.50 BSC

1.50 – 1.75

(NOTE 4)

2.80 BSC

0.22 – 0.36

8 PLCS (NOTE 3)

DATUM ‘A’

0.09 – 0.20

(NOTE 3)

TS8 TSOT-23 0802

2.90 BSC

(NOTE 4)

0.65 BSC

1.95 BSC

0.80 – 0.90

1.00 MAX

0.01 – 0.10

0.20 BSC

0.30 – 0.50 REF

PIN ONE ID

NOTE:

1. DIMENSIONS ARE IN MILLIMETERS

2. DRAWING NOT TO SCALE

3. DIMENSIONS ARE INCLUSIVE OF PLATING

4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR

5. MOLD FLASH SHALL NOT EXCEED 0.254mm

6. JEDEC PACKAGE REFERENCE IS MO-193

3.85 MAX

0.52

MAX

0.65

REF

RECOMMENDED SOLDER PAD LAYOUT

PER IPC CALCULATOR

1.4 MIN

2.62 REF

1.22 REF