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8943 Datasheet(PDF) 3 Page - 3M Electronics |
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8943 Datasheet(HTML) 3 Page - 3M Electronics |
3 / 4 page 3M ™ Thermally Conductive Adhesive Tapes 8940 / 8943 3/4 Thermal Resistance Properties Test Unit Value Test Method Thermal Gravimetric Analysis * Mass loss at 200 °C % < 0,2 Mass loss at 150 °C after 4 h % < 0,3 3M Flame Class: UL 94 V-0, File E253171, Flame rating applies to adhesive film (3M TM Thermally conductive Tape 8940) bonded to 3.0 mm minimum thickness aluminium on one side and 0.86 mm minimum thickness FR-4 laminate on other side. Application Guidelines 1.) Substrate surfaces should be clean and dry prior to tape application. Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface contamination such as dust or finger prints. Do not use “denatured alcohol” or glass cleaners which often contain oily components. Allow the surface to dry for several minutes before applying the tape. More aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or heptane) may be required to remove heavier contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as described above. Note: Be sure to read and follow the manufacturers’ precautions and directions when using primers and solvents. 2) Apply the tape to one substrate at a modest angle with the use of a squeegee, rubber roller pressure to help reduce the possibility of air entrapment under the tape during its application. The liner can be removed after positioning the tape onto the first substrate. 3) Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces with the tape. Proper application of pressure (amount of pressure, time applied, temperature applied) will depend upon design of the parts. The preferred pressure at room temperature is a minimum of 1 kg/cm 2 for 5 seconds. For fragile parts lower pressure may be needed. Rigid substrates are more difficult to bond without air entrapment as most rigid parts are not flat. Flexible substrates can be bonded to rigid or flexible parts with much less concern about air entrapment because one of the flexible substrates can conform to the other substrate. Shelf Life Product shelf life is 2 years from date of manufacture when stored at room temperature conditions 22°C and 50% r.h. in the products original packaging. |
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