HI-1567CDI / T / M

HI-1568CDI / T / M

HI-1567PCI / T

HI-1568PCI / T

Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.

157°C

117°C

57°C

PART NUMBER

PACKAGE STYLE

CONDITION

54°C/W

62°C

122°C

JUNCTION TEMPERATURE

162°C

HI-1567PSI / T / M

HI-1568PSI / T / M

Heat sink

unsoldered

Heat sink

soldered

129°C

169°C

47°C/W

44-pin Plastic chip-

scale package

Heat sink

unsoldered

49°C/W

59°C

119°C

159°C

20-pin Thermally

enhanced plastic

SOIC (ESOIC)

20-pin Ceramic

side-brazed DIP

Socketed

62°C/W

69°C

HI-1567, HI-1568

THERMAL CHARACTERISTICS

Both the HI-1567PSI/T/M and HI-1568PSI/T/M use a

20-

pin thermally enhanced SOIC package. The HI-1567PCI/T

and HI-1568PCI/T use a plastic chip-scale package. These

packages include a metal heat sink located on the bottom

surface of the device. This heat sink should be soldered

down to the printed circuit board for optimum thermal

dissipation. The heat sink is electrically isolated and may

be soldered to any convenient power or ground plane.

Holt Applications Note AN-500 provides circuit design notes

regarding the use of Holt's family of MIL-STD-1553

transceivers. Layout considerations, as well as

recommended interface and protection components are

included.

APPLICATIONS NOTE

HEAT SINK - ESOIC & CHIP-SCALE

PACKAGE

Isolation

Transformer

BUS A/B

BUS A/B

GND

RXA/B

TXA/B

TXA/B

RXA/B

Each Bus

MIL-STD-1553

Transceiver

70W

Point

“AT”

1:1.79

HI-1567 / HI-1568

Figure 4. Transformer Coupled Test Circuit

Isolation

Transformer

BUS A/B

BUS A/B

GND

RXA/B

TXA/B

TXA/B

RXA/B

Each Bus

MIL-STD-1553

Transceiver

55

W

35

W

55

W

Point

“AD”

1:2.5

HI-1567 / HI-1568

Figure 3. Direct Coupled Test Circuit

HOLT INTEGRATED CIRCUITS

6