Dual/Doubler Interleaved MOSFET Driver

October 27, 2011 | FINAL | V1.09

7

IR3598

ABSOLUTE MAXIMUM RATINGS

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are

stress ratings only and functional operation of the device at these or any other conditions beyond those indicated in the

operational sections of the specifications are not implied.

VCC

-0.3V to +7.0V

VDRV

-0.3V to +15.0V

PWM1, PWM2, EN, MODE, FUNCTION

-0.3V to VCC +0.3V

BOOTx-GND, BOOTx – SWx

-0.3V to +35V, -0.3V to +15.0V

LG1, LG2

DC -0.3V to VDRV + 0.3V, <200ns: -5V to VDRV + 0.3V

HG1, HG2

SWx – 0.3V to VBOOT + 0.3V, <20ns: SWx – 5V to VBOOT + 0.3V

SW1, SW2

-0.3V to +35V, <200nS, -8V

ESD

750V HBM

Thermal Information

Thermal Resistance (ΘJC)

3°C/W

Thermal Resistance (ΘJA)

1

45°C/W

Maximum Junction Temperature

150°C

Maximum Storage Temperature Range

-65°C to 150°C

Maximum Lead Temperature (Soldering 10s)

300°C

Note 1: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air.