DPG 30 C 200 HB

advanced

I

RMS

A

per pin

50

K/W

0.25

M

D

Nm

1.2

mounting torque

0.8

T

stg

°C

150

storage temperature

-55

Weight

g

6

Symbol

Definition

Ratings

typ.

max.

min.

Conditions

RMS current

thermal resistance case to heatsink

Unit

I

is typically limited by: 1. pin-to-chip resistance; or by 2. current capability of the chip.

In case of 1, a common cathode/anode configuration and a non-isolated backside, the whole current capability can be used by connecting

the backside.

F

C

N

120

mounting force with clip

20

Ordering

Delivering Mode

Base Qty Code Key

Standard

Part Name

DPG 30 C 200 HB

505797

Tube

30

XXXXXX

YYWW

Logo

Marking on product

DateCode

Assembly Code

abcdef

Product Marking

D

P

G

30

C

200

HB

Part number

Diode

HiPerFRED

extreme fast

Common Cathode

TO-247AD (3)

=

=

=

DPG30C200PB

DPG30C300HB

DPG30C300PB

DPG30C300PC

TO-220

TO-247

TO-220

TO-263 (D2Pak)

Similar Part

Package

1)

1)

Marking on Product

DPG30C200HB

200

300

300

300

Voltage Class

Current Rating [A]

Reverse Voltage [V]

=

=

=

=

RMS

IXYS reserves the right to change limits, conditions and dimensions.

© 2007 IXYS all rights reserved

0629

Data according to IEC 60747and per diode unless otherwise specified