FH33MHJ-65S-0.4SH datasheet(10/16 Pages) HIROSE

Part #	FH33MHJ-65S-0.4SH

Description	0.4mm,0.5mm,1mm Pitch, 1.2mm above the board, Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors

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Manufacturer	HIROSE [Hirose Electric]

Direct Link	http://www.hirose-connectors.com

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FH33 Seriesq0.4mm,0.5mm,1mm Pitch, 1.2mm above the board, Flexible Printed Circuit & Flexible Flat Cable ZIF Connectors

sRecommended Temperature Profile

qUsing Lead-free Solder paste

MAX 250ç

Start

(ç)

Time (Seconds)

25ç

(60 sec.)

90 to 120 sec.

Preheating

Sodering

0

50

100

150

150ç

200ç

230ç

200

250

HRS test conditions

Solder method : Reflow, IR/hot air

Environment

: Room air

Solder composition : Paste, 96.5%Sn/3.0%Ag/0.5%Cu

(Senju Metal Industry, Co., Ltd.’s Part Number: M705-221CM5-32-10.5)

Test board

: Glass epoxy 25mm∞50mm∞0.8mm thick

Land dimensions : Contacts lead 0.3mm∞0.65mm

Metal fittings 0.55mm∞0.8mm

Metal mask

: Contacts lead 0.25mm∞0.65mm∞0.1mm thick

Metal fittings 0.55mm∞0.8mm∞0.1mm thick

This temperature profile is based on the above conditions.

In individual applications the actual temperature may vary,

depending on solder paste type, volume/thickness and board

size/thickness. Consult your solder paste and equipment

manufacturer for specific recommendations.

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FH33MHJ-65S-0.4SH Datasheet(PDF) 10 Page - Hirose Electric

FH33MHJ-65S-0.4SH Datasheet(HTML) 10 Page - Hirose Electric

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