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FX11LA-80S-8-SV71 Datasheet(PDF) 17 Page - Hirose Electric

Part No. FX11LA-80S-8-SV71
Description  0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
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Maker  HIROSE [Hirose Electric]
Homepage  http://www.hirose-connectors.com
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FX11LA-80S-8-SV71 Datasheet(HTML) 17 Page - Hirose Electric

 
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FX11 Seriesq0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm Board-to-Board Connections
B
Recommended Temperature Profile
B
Washing Conditions
B
Connector Handling Precautions
1. Allowable Creepage Dimensions at Time of Mating
2. Compatibility
2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other.
3. Retension of Boards
Avoid the support of boards by connectors alone and adopt a board locking measure that does not rely on the connectors.
4. Solder Repair
Flux may rise as far as the contact portion of the connector depending on the flux coating and other factors at the time of repair.
This will cause poor contact reliability; therefore, before use, the aforementioned washing conditions should be taken into
consideration prior to connector washing.
5. Miscellaneous
·Note that excessive twisting while inserting or withdrawing connectors will cause damage.
·The shade of the molded items may vary somewhat depending on the manufacturing lot; however, this does not affect performance.
Water Type Washing
When using water type cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the
documentation issued by the various manufacturers of cleaning agents which describes the effects on metals and resins.
Be careful that parts are not left with moisture remaining on them.
Washing Precautions
Residual flux or cleaning agent on the contacts when washing with organic solvents or water type cleaners can give rise to the
deterioration of electrical performance. In this regard it is important to check whether a thorough washing has been performed.
Organic Solvent Washing
Solvent
Room temperature washing Heated washing
IPA(Isopropyl alcohol)
HCFC(Hydrochlorofluorocarbon)
Yes
Yes
Yes
Yes
HRS test conditions
Test boardGlass epoxy 60mm∞35mm∞1.6mm thick
Solder method
: Reflow
Solder composition : Paste,96.5%Sn/ 3%Ag/ 0.5%Cu
Metal mask
: 0.15mm thick
Reflow cycles
: 2 cycles
The temperature profile is based on the above conditions.
In individual applications the actual temperature may vary,
depending on solder paste type, volume/thickness and
board size/thickness. Consult your solder paste and
equipment manufacturer for specific recommendations.
Note : The temperature profile indicates the maximum temperature
of the connector surfaces at the highest point from the PCB
mounting surface.
150ç
200ç
220ç
Soldering
(220ç min)
140
180
220
0
160
200
(MAX250ç)
240
260
(90 to 120 sec.)
(60 sec. max.)
Preheating(150 to 200ç)
Time(sec.)
[Stacking height : 2mm]
The effective coupling length of this product is 0.55 mm for
the signal portion and the ground portion. The creepage of
the header and receptacle at the time of mating should be
within 0.18 mm of the completely coupled condition.
[Stacking height : 2.5mm, 3mm]
The effective coupling length of this product is 1 mm for the
signal portion and 0.7mm for the ground portion. The creepage
of the header and receptacle at the time of mating should be
within 0.4 mm of the completely coupled condition.


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